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Microfocus XRay Inspection System Automatic BGA PCB Void Testing

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Microfocus XRay Inspection System Automatic BGA PCB Void Testing

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Brand Name :	WELLMAN
Model Number :	X6800
Certification :	CE,FDA
Payment Terms :	T/T
Delivery Time :	10 days

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Microfocus XRay Inspection System Automatic BGA PCB Void Testing

Microfocus X-Ray Inspection System Automatic BGA PCB Void Testing

The Wellman X6800 Microfocus X-Ray Inspection Machine delivers precision inspection capabilities for SMT electronics manufacturing with advanced features and reliable performance.

Key Advantages

Closed-type X-ray tube: 10,000+ hour service life and maintenance-free performance
5" HD digital flat panel detector (FPD) with 60° tilt functionality
Programmable inspection protocols for automated batch inspection
User-friendly operation with only 2 hours of training required
Auto-navigation window supports precise worktable positioning
530*530mm worktable with 10KG maximum load capacity
5-axis linkage system featuring adjustable movement speed

Hardware Specifications

X-ray Source

Type	Closed, microfocus
Max tube voltage	90kV
Max tube current	200μA
Focal spot size	5μm
Function	Auto preheat

Flat Panel Detector

Effective area	130mm*130mm
Pixel size	85μm
Resolution	1536*1536
Frame rate	20fps
Tiltable angle	60°

Table Specifications

Size	530mm*530mm
Detectable area	500mm*500mm
Max load	10kg

Equipment Specifications

Magnification	Geometry 200X \| System 1500X
Inspection speed	Max 3.0s/point
Dimensions	1360mm (L) * 1365mm (W) * 1730mm (H)
Weight	1200kg
Power supply	AC110-220V 50/60HZ
Max power	1500W
Industrial PC	I5 CPU, 8G RAM, 500GB SSD
Displayer	24" HDMI LCD

Working Principle

X6800 PCB X-ray Inspection Machine working principle diagram

Safety Features

Tube protection feature: Prohibits exiting the software without closing the X-ray tube
Transparent lead glass observation window: Shields radiation while enabling internal viewing
Electromagnetic safety switch: Automatically locks when the X-ray is in operation
Emergency stop button located at the operation position
Safety interlock system for observation window and rear door
Radiation leakage ≤1μSv/h meeting international standards

Software Capabilities

Core Functions

Product list for saving and recalling inspection parameters
Inspection results display (voids rate, distance, area, etc.)
Navigation window for precise table positioning
Mouse/keyboard controlled X-ray tube operation
Adjustable image brightness, contrast and gain
Adjustable axis movement speeds (slow/normal/fast)
Real-time motion axis coordinate display

Voids Rate Measurement

Automatic calculation of solder ball voids with NG/OK indication
Saving parameters for consistent product inspection
Manual void addition through polygon/freehand drawing
Adjustable grayscale threshold, pixel, contrast, and size filtering

Measurement Functions

Distance rate calculation for through-hole soldering
Perimeter measurement for square components
Radius measurement for circular components
Distance measurement between points
Angle measurement between points

Automatic Inspection

Manual inspection point setting
Array inspection for regular patterns
Automatic feature recognition for distinctive inspection points

Application Examples

BGA Solder Bridge

BGA Solder Voids

PCB Through-Hole

IC Voids and Gold Wire

LED Solder Voids

LED Gold Wire Crack

Capacitor

Inductor

Sensor

Thyristor Surge Suppressors

Fiberglass

Cable

Diode

Steel Pipe Welding Gap

Automobile Electronics

Product Tags:

BGA PCB X-ray inspection system

automatic PCB void testing machine

Microfocus X-ray PCB tester

Microfocus XRay Inspection System Automatic BGA PCB Void Testing

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